Lead free solder bar composition

What is lead free solder bar?

The concept of lead free solder bar is comparing to the conventional tin lead solder bar which contains lead, the lead free solder bar is alloy of tin, silver and copper and such alloy of solder bar is to replace the leaded solder bar, because after lead was proven to be no good for human health, in some applications such as soldering of ROHS compliance home appliances, soldering of drinking water pipe are prohibited to use a tin leas solder. That's the reason why lead free solder is developed.

What is the lead free solder bar composition?

In XF Solder lead free series we majorly have 3 types of lead free solder bars with below composition:

SAC305 lead free solder bar. The composition of this solder bar is 96.5% of tin, 3.0% of silver and 0.5% of copper, also written as Sn96.5Ag3.0Cu0.5, this solder bar contains high silver, it's an eutectic solder alloy with melting point 217℃, with superb solder-ability, wetting property, fluidity and excellent electrical conductivity, that is suitable for high precision soldering. It's an high end solder bar alloy.

SAC0307 lead free solder bar. The composition of SAC0307 solder bar is 99% of tin, 0.3% of silver and 0.7% of copper, knon as Sn99Ag0.3Cu0.7. It's a medium end quality solder bar that suitable to be used for medium to high end applications. The reduce of silver greatly save the material cost when comparing to SAC305 solder bar, but the 0.3% of silver inside still gives the solder bar a good solder-ability, though cannot be equivalent to the SAC305, but already so good enough for a lot of medium to high end applications.

SAC07 lead free solder bar. The composition of SAC07 solder is only 99.3% tin and 0.7% copper, without any silver. It's the most economic lead free solder bar among the 3 types. It can meet most of the general purpose of soldering where ROHS compliance is needed. Like in China, for most of the general soldering of electrical or electronic components, the manufacturer uses the SAC07.

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